• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Method of applying in accordance with a pattern thin layers of oxidic superconductive material onto a substrate, it not being necessary to subject the superconductive material to mechanical or chemical treatments. At its surface the substrate is provided in accordance with a desired pattern with two different material compositions. The first composition is chosen such that the oxidic material applied thereon is superconductive at a desired surface temperature. The second composition is chosen such that the oxidic material applied thereon is not superconductive.
    公开号:SU1738104A3
    申请号:SU884356188
    申请日:1988-07-18
    公开日:1992-05-30
    发明作者:Герарда Жозефа Хейман Марица；Корнелис Залм Петер
    申请人:Н.В.Филипс Глоэлампенфабрикен (Фирма)；
    IPC主号:
    专利说明:

    This invention relates to a method for applying thin coatings of superconducting materials to a substrate.
    There is a known method of applying thin layers of superconductor (Lai-x Srx) 2 Cu04, where xm is 0.03, on a substrate of strontium titanate by magnetron sputtering.
    There is a known method of forming superconducting Y-Ba-Cu-0 films on AlzOa substrates with the help of grid-screen printing.
    The electrical resistivity, the microstructure of the films and their adhesion to the substrate strongly depend on the subsequent calcination. At 950 ° C, acceptable adhesion is not provided, and as a result of firing at temperatures above 1000 ° C, phase separation occurs (with the formation of BaCiOa), in addition, the material of the films reacts with the substrate. In addition, these materials have the properties of insufficient stability with respect to moisture, which makes it difficult to use them in semiconductor and sensor devices, where it is necessary to apply superconducting materials in the form of a strictly defined scheme, the details of which should be as small as possible.
    The usual method of applying thin-layer complex schemes, according to which at first a thin layer of coating is applied to the entire surface of the product, after which this layer is formed in the form of a specific scheme using a mask or etching, is in this case not very suitable.
    The purpose of the invention is to simplify the method of manufacturing superconducting devices of plenary type by eliminating additional processing.
    VI
    GO 00
    About 4
    WITH
    The essence of the invention is that before applying a superconducting layer to the substrate on it according to a predetermined pattern, a thin layer of material is applied, which at working temperatures changes the state of superconductivity in the layer above it, when the state of superconductivity of the layer above the substrate is constant, or this state, when the state of superconductivity in the layer above the substrate is changed. In this case, there are two possible solutions to this problem.
    In the first variant, strontium titanate or silver or gold is used as a substrate, and silicon or alumina as a thin layer material.
    In the second embodiment, silicon or alumina is used as the substrate material, a. as a material of a thin layer - strontium titanate or silver, or gold.
    Example 1. A layer of silicon is deposited on a strontium titanate substrate. Cutouts are made in the silicon layer in such a way that the substrate material is left uncoated in some places. This can be done by any known method, for example, by applying a photoresistive coating of the irradiation of the specified photoresistor to the silicon layer with light through the mask and then developing it, followed by local removal of the silicon layer by etching.
    A layer of oxide material is then applied (composition UVA2CizOb, 7), for example, by spraying in vacuum, keeping the substrate at 850 ° C. In the cut-out area, the applied layer is superconducting at about 90 K, and in the area of the silicon layer, the applied layer does not have the property of superconductivity at the specified temperature. If necessary, the oxide superconducting layer can later be covered with a protective layer to minimize environmental exposure.
    It is possible to replace this superconducting material. For example, yttrium can be replaced in whole or in part by ions of rare-earth materials, barium can be replaced by strontium or calcium, and oxygen can be partially replaced by fluorine.
    Instead of vapor deposition, the oxide layer can be applied, for example, by sputtering using a printed circuit board of the desired composition. The substrate can be maintained at a high temperature, for example in the range from 800 to 900 ° C, however
    alternatively, it is possible to carry out precipitation at a lower temperature. In this case, subsequent processing is required to obtain superconducting properties.
    Example 2. A layer of silver is deposited on a silicon substrate. Instead of silver, you can use a layer of gold or strontium titanate. In the silver layer are cutouts, and
    0 in such a way that the circuit remains in the form of silver conductors. The treatment is carried out as described in Example 1. After that, a layer of oxide material is applied, for example, using the method indicated in Example 1, using the composition indicated therein. In those places where there are silver conductors, the oxide material has the property of superconductivity, in those places where the oxide is
    0 The material is deposited directly on a silicon substrate, it does not possess the property of superconductivity.
    The present invention provides a simple method for applying super5 conductive oxide materials in the form of a circuit, the shape of the circuit is determined before the superconducting material is applied. In this case, the phenomenon is used, which consists in the fact that small violations of the composition and / or structure of the oxide material may be quite sufficient so that the specified material does not have the property of superconductivity at a given temperature.
    权利要求:
    Claims (5)
    [1]
    1. Method of manufacturing a planar-type superconducting device, comprising applying a layer of YBaaCuaOv-tf oxide superconducting material to a substrate
    0 and high-temperature annealing, characterized in that, in order to simplify the method by eliminating the need for additional processing, before applying a layer of oxide superconducting material to the substrate, a thin layer of material is applied according to a given pattern, which at working temperatures changes the state of superconductivity in the layer above it, when the state of superconductivity of the layer above the substrate is constant, or the preservation of this state, when the state of superconductivity in the layer above the substrate is changed.
    [2]
    2. Able to claim 1, characterized in that 5 that strontium titanate, silver or gold is used as the substrate material.
    [3]
    3. Method according to paragraphs. 1 and 2, that is, so that silicon or alumina is used as the material of the thin layer.
    517381046
    [4]
    4. The method according to p. 1, about tl and h and y y and y
    [5]
    5. The method according to paragraphs. 1 and 4. About tl and h and y and n with the fact that as a material under - so that as a material thin
    Spoons. Silicon or oxide is used using stantium titanet or aluminum fin or gold.
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    同族专利:
    公开号 | 公开日
    DE3886115T2|1994-06-09|
    EP0300567B1|1993-12-08|
    KR890003053A|1989-04-12|
    US4957899A|1990-09-18|
    EP0300567A3|1989-05-10|
    JPS6441282A|1989-02-13|
    DE3886115D1|1994-01-20|
    KR970005156B1|1997-04-12|
    NL8701718A|1989-02-16|
    US4900709A|1990-02-13|
    AT98401T|1993-12-15|
    EP0300567A2|1989-01-25|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US4316785A|1979-11-05|1982-02-23|Nippon Telegraph & Telephone Public Corporation|Oxide superconductor Josephson junction and fabrication method therefor|
    US4255474A|1980-01-04|1981-03-10|Rockwell International Corporation|Composite having transparent conductor pattern|
    US4290843A|1980-02-19|1981-09-22|Texas Instruments Incorporated|Epitaxial growth of magnetic memory film on implanted substrate|
    KR950010206B1|1987-03-09|1995-09-11|가부시끼가이샤 한도다이 에네르기 겐꾸쇼|Electronic device and manufacturing method thereof|
    US4960751A|1987-04-01|1990-10-02|Semiconductor Energy Laboratory Co., Ltd.|Electric circuit having superconducting multilayered structure and manufacturing method for same|
    JPS63291485A|1987-05-25|1988-11-29|Fujikura Ltd|Manufacture of oxide superconducting circuit|
    CN1017110B|1987-08-13|1992-06-17|株式会社半导体能源研究所|Superconducting devices|EP0301689B1|1987-07-27|1993-09-29|Ovonic Synthetic Materials Company, Inc.|Method of stabilizing high tc superconducting material and the material so stabilized|
    JPS6457438A|1987-08-28|1989-03-03|Mitsubishi Electric Corp|Recording medium|
    JPH01171247A|1987-12-25|1989-07-06|Mitsubishi Metal Corp|Structure of superconductor interconnection|
    GB2215548B|1988-02-26|1991-10-23|Gen Electric Co Plc|A method of fabricating superconducting electronic devices|
    JPH0244784A|1988-08-05|1990-02-14|Canon Inc|Superconductive pattern forming method|
    US5246916A|1989-03-22|1993-09-21|Sri International|Method of forming shaped superconductor materials by electrophoretic deposition of superconductor particulate coated with fusible binder|
    US5229360A|1989-07-24|1993-07-20|The Furukawa Electric Co., Ltd.|Method for forming a multilayer superconducting circuit|
    US5135908A|1989-08-07|1992-08-04|The Trustees Of Columbia University In The City Of New York|Method of patterning superconducting films|
    EP0450394A3|1990-03-20|1991-10-23|Fujitsu Limited|Method and apparatus for forming superconductor layer|
    US5856275A|1990-11-01|1999-01-05|Sumitomo Electric Industries, Ltd.|Superconducting wiring lines and process for fabricating the same|
    JPH0697522A|1990-11-30|1994-04-08|Internatl Business Mach Corp <Ibm>|Manufacture of thin film of super- conducting material|
    US5252551A|1991-12-27|1993-10-12|The United States Of America As Represented By The Department Of Energy|Superconducting composite with multilayer patterns and multiple buffer layers|
    US5593918A|1994-04-22|1997-01-14|Lsi Logic Corporation|Techniques for forming superconductive lines|
    JP3076503B2|1994-12-08|2000-08-14|株式会社日立製作所|Superconducting element and method of manufacturing the same|
    DE102006030787B4|2006-06-30|2008-11-27|Zenergy Power Gmbh|Negative structuring of thin-film high-temperature superconductors|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    NL8701718A|NL8701718A|1987-07-21|1987-07-21|METHOD FOR APPLYING THIN LAYERS OF OXIDIC SUPER CONDUCTIVE MATERIAL|
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